| Structure: | Multilayer FPC |
|---|---|
| Material: | Polyimide |
| Application: | Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace |
| Conductive Adhesive: | Conductive Silver Paste |
| Flame Retardant Properties: | V0 |
| Processing Technology: | Electrolytic Foil |
| Samples: |
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| Customization: |
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