| Customization: | Available |
|---|---|
| Structure: | Multilayer Rigid PCB |
| Dielectric: | FR-4 |
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PCB Parameters
| Item | PCB Parameters |
| Material | FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic, etc |
| Material Brands | KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or other laminate on customer's request |
| Layer Count | 1-40 |
| Flammaility | UL 94V-0 |
| Thermal Conductivity | 0.3W-300W/mk |
| Quality Standards | IPC Classes 2/3 |
| HDI Build-up | Any Layer, up to 3+N+3 |
| Board Thickness | 0.2~7mm |
| Min Thickness | 2-layer: 0.2mm 4-layer: 0.4mm 6-layer: 0.6mm 8-layer: 0.8mm 10-layer: 1mm More than 10 layers: 0.5*Layer Count*0.2mm |
| Copper Thickness | 0.5-20oz |
| Inks | Super White Inks/Solar/Carbon Inks |
| Solder Mask Thickness | 0.2mil-1.6mil |
| Surface Finishes | Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc |
| Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
| Min Hole Size | 0.15mm |
| Min Trace Width/Spacing | 2mil/2mil |
| Via Plugging | 0.2~0.8mm |
| Line Width/Space Tolerance | ±10% |
| Board Thickness Tolerance | ±5% |
| Hole Diameter Tolerance | ±0.05mm |
| Hole Location Tolerance | ±2mil |
| Layer to Layer Registration | 2mil |
| S/M Registration | 1mil |
| Aspect Ratio | 10:01 |
| Blind Vias Aspect Ratio | 1:01 |
| Outline Tolerance | ±0.1mm |
| V- CUT Tolerance | ±10mi |
| Bevel Edge | ± 5mil |
| Warp and Twist | ≤0.50% (max cap) |
| Quality Test | AOI, 100% E-test |
| Value-Added Services | DFM Check, Expedited Production |
| Featured Processes | Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat |
| Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
PCBA Abilities
| Item | PCBA Abilities |
| Turnkey Service | PCB Design + PCB FAB + Components Sourcing + PCB Assembly + Package |
| Value-Added Services | BOM Analysis, Conformal Coating, IC Programming, Wire Harness & Cable Assembly, Box Building |
| Assembly Details | 5 SMT + 2 DIP (Dust and anti-static lines) |
| Assembly Abilities | SMT 5 million points per day DIP 10 thousands pieces per day |
| Technical Support | Free DFM/A check, BOM analysis |
| Handing Standards | IPC-A-600H, IPC-A-610F, J-STD-001F |
| MOQ | 1 piece |
| Inspection & Testing | Visual Inspection, AOI, SPI, X-ray inspection. First article inspection for each process. |
| IQC + IPQC + FQC + OQC Inspection Flow | |
| Flying probe test/In-circuit test/Function test/Burn-in test | |
| Files We Need | PCB: Gerber (CAM, PCB, PCBDOC) |
| Components: Bill of Material (BOM list) | |
| Assembly: Pick-and-Place file | |
| Functional test: Test Guide | |
| PCB Panel Size | Min: 0.25×0.25 inches (6×6mm) |
| Max: 20×20 inches (500×500mm) | |
| PCB Solder Type | Water soluble solder paste, RoHS lead-free |
| PCB Assemble Methods | SMT, THT & Hybrid, single or double side placement, Part removal and replacement. |
| Components Details | Passive down to 0201 (01005) size |
| Press fit connectors | |
| QFP/BGA/LGA/QFN/COB/COF | |
| CSP/WLCSP/POP | |
| Fine Pitch High Pin Count Connectors | |
| BGA repair and reball | |
| Lead Time | Prototype: 5-15 working days; Mass production: 20~25 working days. The fastest delivery time is 3 days. |
| Packaging | Anti-Static Bags/Customized Packaging |
Main Customers
Process
PCBA Showcase
SMT & DIP Workshop
| Material Brand | ShengYi, NanYa, ITEQ, Ventec, etc |
| Regular Thickness | 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm |
| Normal Size (FR4 Sheet) (length x width mm) |
1220x914, 1220x1016, 1220x1066 1232x927, 1295x1092, 1280x1080 1245x940, 1245x1041, 1245x1092 |
| Normal Size (MCPCB Sheet) (length x width mm) |
1000x1200, 1050x1250 |
| Key inspection items | 1.Manufacturer Brand; 2.Material certificate; 3.Appearance of the material; 4.Dimension; 5.Sample checking. |
Key Specifications Quality Control Under Production Process
| Equipment | Function |
| Inner and outer AOI machine | It can perform AOI detection on inner and outer layers, confirm whether the circuit is qualified and access. |
| AVI | Before FQC visual inspection, intercept bad appearance effectively and play the role of double insurance |
| VCP Pattern Plating line | The electroplating quality is more stable than the traditional electroplating line and greatly improves the output |
| Ionic contamination tester | This machine is needed in the physics laboratory to test the degree of ion contamination of the circuit board and avoid risks |
Test and Maintenance Workshop
CERTIFICATIONS
FAQ
Q1: What's your monthly capacity of PCB assembly
A: Monthly 140 million points from SMT, 300K pieces from DIP.
Q2: How do you go quality control in PCB assembly?
A: We fully comply with ISO requirements and process in accordance with the Quality Management Manual for order management, production management, and process management, and strictly implement processes such as corrective and preventive measures and change management.
Q3: Can you source parts for me even if no assembly need?
A: Absolutely please provide us with your BOM or a list we will analyze the source make classified packaging attached with labels then send them to you.
Q4: What is your components procurement capability? Which supplier do you work with directly?
A: We have more than 40,000 part models in stock, and provide you with hard-to-get chip supply. Our parts are directly from the top level suppliers such as Microchip, TI, ARROW, AVNET, FUTURE, ELMENT, Digikey...
Q5: How do you go inventory management?
A: According to ISO process warehouse management operation guideline, we observe the principle of first-in-first-out of materials, and control the temperature (constant 25°C) and humidity (40% RH) of the warehouse with strict anti-static. Stock materials are managed separately according to different customers.
Q6: How are EOL (End of Life) materials handled? Is it possible to provide the successful case of replacing EOL material?
1. If EOL happens in the running projects, the agent will send a production stoppage notice (Order & Supply deadline), and then our clients will get notified with our alternative suggestions.
2. For the projects transferred from other production source, we will source alternatives in advanced, or come up with and help our clients to change the design if no exact match alternatives.
3. For other cases, we will try to meet the short-term needs of customers based on our understanding of the market inventory situation.
Q7: Do you provide IC programming and fixture creation?
A: IC programming is available for all of our customers, please provide the guidelines and software, it can be done by IC burner or motherboard burn-in. We can make the fixtures as customers' requirements.
Q8: What test methods do you provide?
A: The boards will go through AOI, X-ray, default circuit testing, function testing in regular, and more testing as required.
Q9: What's the lead time?
A: It depends on the quantity and BOM. For usual small batches, it takes about 3-5 weeks, when it comes to mass production for forecast orders, we will schedule the production about 10-12 weeks before delivery.
Q10: How do you ensure delivery on time?
A: We generally guarantee delivery within 5 days after the material is ready (except for rush orders), our measures include:
1. receiving and verifying the files prior to quotation;
2. ensuring all the materials get ready on time and be checked at the same time;
3. making PCB boards and stencil according to Gerber first;
4. communicate in time when prototyping is running to ensure that problems are handled on the same day.
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