Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | DIP SMT |
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PCBA Abilities
Item | PCBA Abilities |
Turnkey Service | PCB Design + PCB FAB + Components Sourcing + PCB Assembly + Package |
Value-Added Services | BOM Analysis, Conformal Coating, IC Programming, Wire Harness & Cable Assembly, Box Building |
Assembly Details | 5 SMT + 2 DIP (Dust and anti-static lines) |
Assembly Abilities | SMT 5 million points per day DIP 10 thousands pieces per day |
Technical Support | Free DFM/A check, BOM analysis |
Handing Standards | IPC-A-600H, IPC-A-610F, J-STD-001F |
MOQ | 1 piece |
Inspection & Testing | Visual Inspection, AOI, SPI, X-ray inspection. First article inspection for each process. |
IQC + IPQC + FQC + OQC Inspection Flow | |
Flying probe test/In-circuit test/Function test/Burn-in test | |
Files We Need | PCB: Gerber (CAM, PCB, PCBDOC) |
Components: Bill of Material (BOM list) | |
Assembly: Pick-and-Place file | |
Functional test: Test Guide | |
PCB Panel Size | Min: 0.25×0.25 inches (6×6mm) |
Max: 20×20 inches (500×500mm) | |
PCB Solder Type | Water soluble solder paste, RoHS lead-free |
PCB Assemble Methods | SMT, THT & Hybrid, single or double side placement, Part removal and replacement. |
Components Details | Passive down to 0201 (01005) size |
Press fit connectors | |
QFP/BGA/LGA/QFN/COB/COF | |
CSP/WLCSP/POP | |
Fine Pitch High Pin Count Connectors | |
BGA repair and reball | |
Lead Time | Prototype: 5-15 working days; Mass production: 20~25 working days. The fastest delivery time is 3 days. |
Packaging | Anti-Static Bags/Customized Packaging |
PCB Parameters
Item | PCB Parameters |
Material | FR4 (140Tg, 170Tg, 180Tg), FR-406, FR-408, 370HR, IT180A, Metal Core, Polyimide, Rogers 4350B/3003/4003C/5880, Taconic etc |
Material Brands | KB, ITEQ, SY, ISOLA, Rogers (Arlon), Ventec, Laird, Nelco, Bergquist, DENKA, Panasonic, Taconic, or other laminate on customer's request |
Layer Count | 1-40 |
Flammaility | UL 94V-0 |
Thermal Conductivity | 0.3W-300W/mk |
Quality Standards | IPC Classes 2/3 |
HDI Build-up | Any Layer, up to 3+N+3 |
Board Thickness | 0.2~7mm |
Min Thickness | 2-layer: 0.2mm 4-layer: 0.4mm 6-layer: 0.6mm 8-layer: 0.8mm 10-layer: 1mm More than 10 layers: 0.5*Layer Count*0.2mm |
Copper Thickness | 0.5-20oz |
Inks | Super White Inks/Solar/Carbon Inks |
Solder Mask Thickness | 0.2mil-1.6mil |
Surface Finishes | Bare Copper, Hasl lead-free, ENIG, ENEPIG, Gold Fingers, OSP, IAg, ISn, etc |
Plating Thickness | HASL: Copper Thickness: 20-35um Tin: 5-20 um Immersion Gold: Nickel: 100u"-200u" Gold: 2u" -4u" Hard Plated Gold: Nickel: 100u"-200u" Gold: 4u"-8u" Golden Finger: Nickel: 100u"-200u" Gold: 5u"-15u" Immersion Silver: 6u"-12u" OSP: Film 8u"-20u" |
Min Hole Size | 0.15mm |
Min Trace Width/Spacing | 2mil/2mil |
Via Plugging | 0.2~0.8mm |
Line Width/Space Tolerance | ±10% |
Board Thickness Tolerance | ±5% |
Hole Diameter Tolerance | ±0.05mm |
Hole Location Tolerance | ±2mil |
Layer to Layer Registration | 2mil |
S/M Registration | 1mil |
Aspect Ratio | 10:01 |
Blind Vias Aspect Ratio | 1:01 |
Outline Tolerance | ±0.1mm |
V- CUT Tolerance | ±10mi |
Bevel Edge | ± 5mil |
Warp and Twist | ≤0.50% (max cap) |
Quality Test | AOI, 100% E-test |
Value-Added Services | DFM Check, Expedited Production |
Featured Processes | Bonding, Impedance Control, Via in Pad, Press Fit Hole, Countersink/Counterbore Hole, Castellated Vias, Edge Plating, Peelable Solder Mask, Resin Plugged, Plating Flat |
Data Formats | Gerber, DXF, PCBdoc, ODB++, HPGL, BRD, etc |
One-Stop OEM PCB Assembly Professional Turnkey PCBA
Main Customers
Process
PCBA Showcase
SMT & DIP Workshop
Material Brand | ShengYi, NanYa, ITEQ, Ventec, etc |
Regular Thickness | 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm |
Normal Size (FR4 Sheet) (length x width mm) |
1220x914, 1220x1016, 1220x1066 1232x927, 1295x1092, 1280x1080 1245x940, 1245x1041, 1245x1092 |
Normal Size (MCPCB Sheet) (length x width mm) |
1000x1200, 1050x1250 |
Key inspection items | 1.Manufacturer Brand; 2.Material certificate; 3.Appearance of the material; 4.Dimension; 5.Sample checking. |
Equipment | Function |
Inner and outer AOI machine | It can perform AOI detection on inner and outer layers, confirm whether the circuit is qualified and access. |
AVI | Before FQC visual inspection, intercept bad appearance effectively and play the role of double insurance |
VCP Pattern Plating line | The electroplating quality is more stable than the traditional electroplating line and greatly improves the output |
Ionic contamination tester | This machine is needed in the physics laboratory to test the degree of ion contamination of the circuit board and avoid risks |
Test and Maintenance Workshop
CERTIFICATIONS
FAQ
Q1: What's your monthly capacity of PCB assembly